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微机电器件设计.制造及计算机辅助设计 内容简介
Thisbookfirstlyintroducesthepertinentfundamentaltheory，importantmaterialandfabricationprocessofmicroＧelectromechanicalsystems．Basedonthesetheories，thedesignruleandimportantengineeringexamplesaredescribedindetail．Then，manyengineeringapplicationsforMEMSincludingtheaccelerationmeasurement，theangularspeedmeasurementandthepressuremeasurementareintroduced．Finally，finiteelementmethodisintroducedinordertoprovethecorrectnessofthedesign．Thisengineeringapplicationofsimulationincludesthestaticandmodalanalysisofthebeam，capacitanceanalysis，thermalＧstructureanalysisofthedeviceandfatigueanalysisetc．Itcanbeselectedasthereferencetothepostgraduates，undergraduatesandpertinentengineeringstaffwhoseresearch directionsareinstrumentationscienceandtechnology，controlscienceandengineering，mechanicalengineeringetc．
微机电器件设计.制造及计算机辅助设计 目录
Chapter1 Introduction ………………………………………………………………………… 1
1．1 ConceptofMEMS ……………………………………………………………………… 1
1．2 DevelopmentofMEMS ………………………………………………………………… 4
1．3 MEMSCAD …………………………………………………………………………… 9
Chapter2 BasictheoryofMEMS …………………………………………………………… 12
2．1 TheoryofelectrostaticMEMScombactuators …………………………………… 12
2．1．1 Introduction ……………………………………………………………………… 12
2．1．2 Operatingprinciples …………………………………………………………… 13
2．1．3 Platecapacitortheoryinidealcondition ……………………………………… 14
2．1．4 ThemodifiedmodelofMEMSplatecapaciator ……………………………… 17
2．1．5 Calculationofelectrostaticcombdrivingforceinidealsituation …………… 24
2．1．6 Weakcapacitancedetectionmethodofelectrostaticcombdrive …………… 26
2．2 RelevanttheoreticalcalculationsfortheMEMScantileverbeam ………………… 34
2．2．1 Introduction ……………………………………………………………………… 34
2．2．2 Theoreticalcalculationmethodforcantileverbeam ………………………… 35
2．2．3 RelevanttheoreticalcalculationofaxialtensileandcompressiveonsingleGend
clampedbeams ………………………………………………………………… 36
2．2．4 RelatedtheoreticalcalculationsofdoubleGendclampedbeamsaxialtension
andcompression ………………………………………………………………… 40
2．3 MembranetheoryofMEMS ………………………………………………………… 47
2．3．1 Theoryofclampedaroundcirculardiaphragm ………………………………… 48
2．3．2 Theoryofclampedaroundrectangularflatdiaphragm ……………………… 49
References …………………………………………………………………………………… 52
Chapter3 MEMSmaterials …………………………………………………………………… 53
3．1 Monocrystallinesilicon ……………………………………………………………… 53
3．1．1 Introduction ……………………………………………………………………… 53
3．1．2 Crystalorientationofmonocrystallinesilicon ………………………………… 55
3．2 Polycrystallinesilicon ………………………………………………………………… 64
3．3 Silica …………………………………………………………………………………… 66
3．4 Piezoelectricmaterials ………………………………………………………………… 67
3．4．1 Piezoelectriceffectandinversepiezoelectriceffectofmaterials …………… 67
3．4．2 Quartzcrystal …………………………………………………………………… 68
3．4．3 Piezoelectricceramics …………………………………………………………… 73
3．5 OtherMEMSmaterials ……………………………………………………………… 75
3．6 Summary ……………………………………………………………………………… 76
Chapter4 MEMStechnology ………………………………………………………………… 77
4．1 MEMSlithographyprocess ………………………………………………………… 78
4．2 KeytechnologyofMEMSlithographyprocess …………………………………… 80
4．2．1 Wafercleaning …………………………………………………………………… 80
4．2．2 Siliconoxidation ………………………………………………………………… 80
4．2．3 Spincoatingprocess …………………………………………………………… 87
4．2．4 Prebaking ………………………………………………………………………… 90
4．2．5 Exposure ………………………………………………………………………… 92
4．2．6 Development ……………………………………………………………………… 94
4．2．7 Hardening ………………………………………………………………………… 96
4．2．8 FabricationoftheSiO2 window ………………………………………………… 97
4．3 SubsequentprocessofMEMS ……………………………………………………… 98
4．3．1 Bulksilicontechnology ………………………………………………………… 98
4．3．2 Surfacesiliconprocess ………………………………………………………… 103
4．3．3 LIGAtechnology ……………………………………………………………… 104
4．3．4 Sputteringtechnology ………………………………………………………… 105
4．3．5 LiftGoffprocess ………………………………………………………………… 107
4．4 Filmpreparationtechnology………………………………………………………… 107
4．5 Bondingprocess ……………………………………………………………………… 108
4．5．1 Anodicbondingprocess………………………………………………………… 109
4．5．2 SiliconGsilicondirectbonding ………………………………………………… 110
4．5．3 Metaleutecticbonding ………………………………………………………… 113
4．5．4 Coldpressureweldingbonding ……………………………………………… 114
4．6 Engineeringexamplesofcombinationformultipleprocessestofabricatethe
MEMSdevice ………………………………………………………………………… 115
4．6．1 Introduction …………………………………………………………………… 115
4．6．2 EngineeringexampleoffabricationprocessforresonantMEMSgyroscope
…………………………………………………………………………………… 115
4．6．3 EngineeringexampleofelectromagneticmicroGmotorproductionprocess
…………………………………………………………………………………… 118
4．7 Summary ……………………………………………………………………………… 124
References…………………………………………………………………………………… 125
Chapter5 Frictionwearandtearundermicroscale ……………………………………… 126
5．1 OffGchiptestingmethodformicrofriction ………………………………………… 127
5．1．1 MicroGtribologytestwiththepinGonGdiscmeasuringmethod ……………… 127
5．1．2 MicroGtribologytestwithAFM ……………………………………………… 128
5．1．3 MicroGtribologytestwithspecialmeasuringdevice ………………………… 130
5．2 OnGchiptestingmethodformicrofriction ………………………………………… 132
5．2．1 OnGchiptestingmethodactuatedbyelectrostaticforce …………………… 132
5．2．2 OnGchipmicroGfrictiontestingmethodusingthemechanismcharactersof
thebimorphmaterial…………………………………………………………… 139
5．3 ExampleofthedesignforanonGchipmicroGfrictionstructure ………………… 141
5．3．1 Structureandworkingprinciple ……………………………………………… 141
5．3．2 Calculationofpertinenttheory ……………………………………………… 142
5．3．3 Technologicalanalysisofstructuraldesign ………………………………… 148
5．3．4 Testingresultsanddataanalysis……………………………………………… 152
5．3．5 ResearchandtestofwearproblemofMEMSdevices ……………………… 161
5．4 Summary ……………………………………………………………………………… 165
References…………………………………………………………………………………… 165
Chapter6 MEMStestingtechnologyandengineeringapplication ………………………… 169
6．1 Accelerationmeasurementandcorrespondingsensors …………………………… 169
6．1．1 Workingprincipleoftheaccelerationsensorandtheclassification ……… 170
6．1．2 Capacitivesiliconmicromechanicalaccelerometer …………………………… 172
6．1．3 Piezoresistivesiliconmicromechanicalaccelerometer ……………………… 173
6．1．4 Piezoelectricmicromechanicalaccelerometer ………………………………… 174
6．1．5 ResonantsiliconMEMSaccelerometer ……………………………………… 175
6．2 Angularspeedmeasurementandcorrespondingsensors ………………………… 177
6．2．1 Workingprinciple ……………………………………………………………… 177
6．2．2 DevelopmentofMEMSgyroscope …………………………………………… 178
6．2．3 Classificationofmicromechanicalgyroscope ………………………………… 188
6．3 Pressuremeasurementandcorrespondingsensors ……………………………… 190
6．3．1 Workingpincinple ……………………………………………………………… 190
6．3．2 Resonantsiliconmicromechanicalpressuresensoranditsdevelopment … 193
6．4 MeasurementofmicroGtorque ……………………………………………………… 198
6．4．1 Introduction …………………………………………………………………… 198
6．4．2 Workingprincipleofnoncontactmethod …………………………………… 199
6．4．3 Theoreticalcalculation ………………………………………………………… 200
6．4．4 Correspondingequipmenttorealizethenoncontactmethod ……………… 205
6．4．5 Experimentresultanddiscussion …………………………………………… 209
6．5 Microscopicmorphologytestingmethod ………………………………………… 211
6．6 Summary ……………………………………………………………………………… 212
References…………………………………………………………………………………… 212
Chapter7 Applicationexamplesofthefiniteelementmethodinthedesignof
MEMSdevices …………………………………………………………………… 218
7．1 Importantconceptsofthesoftware………………………………………………… 218
7．2 IntroductionoftheAnsyssoftwareinterface……………………………………… 220
7．3 ThecoordinatesysteminAnsys …………………………………………………… 221
7．4 Engineeringexamples ……………………………………………………………… 226
7．4．1 StaticanalysisofsingleGclampedbeam ……………………………………… 226
7．4．2 ModalanalysisofdoubleGclampedbeam ……………………………………… 245
7．4．3 CapacitanceanalysisofMEMSelectrostaticcombfingersdrive …………… 257
7．4．4 Fatiguestrengthcalculationexample ………………………………………… 264
7．5 Summary ……………………………………………………………………………… 272
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