集成电路封装材料的表征 本书特色
《集成电路封装材料的表征(英文)》的主要内容包括： foreword；preface to the reissue of the materials characterization series xiii；preface to series xiv；preface to the reissue of integrated circuit packaging materials xv；preface xvi；contributors xix等。
集成电路封装材料的表征 目录
foreword xi
preface to the reissue of the materials characterization series xiii
preface to series xiv
preface to the reissue of integrated circuit packaging materials xv
preface xvi
contributors xix
ic package reliability testing
mold compound adhesion and strength
mechanical stress in ic packages
moisture sensitmty and delamination
thermal management
electrical performance of ic packages
solderability of integrated circuits
hermeticity and joining in ceramic ic packages
advanced interconnect technology
appendix： technique summaries
集成电路封装材料的表征 作者简介
Thomas M. Moore and Robert G. McKennaForeword by Walter H. Schroen， TI FELLOWCharacterization of Integrated Circuit Packaging Materials deals with the systemsof materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniquesappropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technologicalproblems of IC packages. This book discusses issues which affect a varietyof package types， including plastic surface—mount packages， hermetic packages， and advanced designs such as flip—chip， chip—on—board， and multi—chipmodels.
