微机电器件设计.制造及计算机辅助设计
微机电器件设计.制造及计算机辅助设计作者:郭占社 开 本:32开 书号ISBN:9787512421097 定价: 出版时间:2016-05-01 出版社:北京航空航天大学出版社 |
微机电器件设计.制造及计算机辅助设计 内容简介
Thisbookfirstlyintroducesthepertinentfundamentaltheory,importantmaterialandfabricationprocessofmicroGelectromechanicalsystems.Basedonthesetheories,thedesignruleandimportantengineeringexamplesaredescribedindetail.Then,manyengineeringapplicationsforMEMSincludingtheaccelerationmeasurement,theangularspeedmeasurementandthepressuremeasurementareintroduced.Finally,finiteelementmethodisintroducedinordertoprovethecorrectnessofthedesign.Thisengineeringapplicationofsimulationincludesthestaticandmodalanalysisofthebeam,capacitanceanalysis,thermalGstructureanalysisofthedeviceandfatigueanalysisetc.Itcanbeselectedasthereferencetothepostgraduates,undergraduatesandpertinentengineeringstaffwhoseresearch directionsareinstrumentationscienceandtechnology,controlscienceandengineering,mechanicalengineeringetc.
微机电器件设计.制造及计算机辅助设计 目录
Chapter1 Introduction ………………………………………………………………………… 11.1 ConceptofMEMS ……………………………………………………………………… 1
1.2 DevelopmentofMEMS ………………………………………………………………… 4
1.3 MEMSCAD …………………………………………………………………………… 9
Chapter2 BasictheoryofMEMS …………………………………………………………… 12
2.1 TheoryofelectrostaticMEMScombactuators …………………………………… 12
2.1.1 Introduction ……………………………………………………………………… 12
2.1.2 Operatingprinciples …………………………………………………………… 13
2.1.3 Platecapacitortheoryinidealcondition ……………………………………… 14
2.1.4 ThemodifiedmodelofMEMSplatecapaciator ……………………………… 17
2.1.5 Calculationofelectrostaticcombdrivingforceinidealsituation …………… 24
2.1.6 Weakcapacitancedetectionmethodofelectrostaticcombdrive …………… 26
2.2 RelevanttheoreticalcalculationsfortheMEMScantileverbeam ………………… 34
2.2.1 Introduction ……………………………………………………………………… 34
2.2.2 Theoreticalcalculationmethodforcantileverbeam ………………………… 35
2.2.3 RelevanttheoreticalcalculationofaxialtensileandcompressiveonsingleGend
clampedbeams ………………………………………………………………… 36
2.2.4 RelatedtheoreticalcalculationsofdoubleGendclampedbeamsaxialtension
andcompression ………………………………………………………………… 40
2.3 MembranetheoryofMEMS ………………………………………………………… 47
2.3.1 Theoryofclampedaroundcirculardiaphragm ………………………………… 48
2.3.2 Theoryofclampedaroundrectangularflatdiaphragm ……………………… 49
References …………………………………………………………………………………… 52
Chapter3 MEMSmaterials …………………………………………………………………… 53
3.1 Monocrystallinesilicon ……………………………………………………………… 53
3.1.1 Introduction ……………………………………………………………………… 53
3.1.2 Crystalorientationofmonocrystallinesilicon ………………………………… 55
3.2 Polycrystallinesilicon ………………………………………………………………… 64
3.3 Silica …………………………………………………………………………………… 66
3.4 Piezoelectricmaterials ………………………………………………………………… 67
3.4.1 Piezoelectriceffectandinversepiezoelectriceffectofmaterials …………… 67
3.4.2 Quartzcrystal …………………………………………………………………… 68
3.4.3 Piezoelectricceramics …………………………………………………………… 73
3.5 OtherMEMSmaterials ……………………………………………………………… 75
3.6 Summary ……………………………………………………………………………… 76
Chapter4 MEMStechnology ………………………………………………………………… 77
4.1 MEMSlithographyprocess ………………………………………………………… 78
4.2 KeytechnologyofMEMSlithographyprocess …………………………………… 80
4.2.1 Wafercleaning …………………………………………………………………… 80
4.2.2 Siliconoxidation ………………………………………………………………… 80
4.2.3 Spincoatingprocess …………………………………………………………… 87
4.2.4 Prebaking ………………………………………………………………………… 90
教材 研究生/本科/专科教材 工学
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